Having X-axis and Y-axis for the θ-axis and the Z-axis mechanism for compensating the wafer position.
Throughput is improved.
High accuracy (Notch accuracy: ±0.05°, Center accuracy: ±0.05 mm).
Handling of transparent glass and laminate wafers.
Having X-axis and Y-axis for the θ-axis and the Z-axis mechanism for compensating the wafer position.
Throughput is improved.
High accuracy (Notch accuracy: ±0.05°, Center accuracy: ±0.05 mm).
Handling of transparent glass and laminate wafers.
| Wafer size |
Dia. 150mm to 300mm RA420-6CV-L Dia. 100mm-200mm RA420-48V-L |
| Notch angle accuracy | ±0.05 to ±0.1° Changes according to the alignment mode. |
| Center accuracy | ±0.05 to ±0.1mm Changes according to the alignment mode. |
| Positioning time interval | 2.5 to 6.5sec Changes according to the alignment mode. |
| Power supply | 24V DC 4A |
| Communication method | TCP/IP （RS-232C is also available as an option） |
